TSMC's partnership with Amkor Technology signals a significant move towards enhancing the US semiconductor supply chain, as outlined in the CHIPS Act's goals.
The new advanced packaging facility in Peoria, Arizona, emphasizes the importance of local production capabilities, particularly in fan-out wafer packaging used by industry giants.
This collaboration marks a strategic shift for the US, aiming to diminish reliance on Taiwanese and South Korean production for advanced chip packaging and testing.
With geopolitical tensions in East Asia, establishing advanced semiconductor facilities in the US reduces risks and strengthens national security regarding technology supply chains.
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