""This is where I think our R&D has done exceptionally well in terms of leveraging existing EUV technology while setting an aggressive technology scaling roadmap," says Kevin Zhang, deputy co-chief operations officer and senior vice president at TSMC. "This is definitely a strength.""
"Combining multiple chips presents its own challenges. Chips generate heat during use, and the various materials used in the packaging expand differently when heated. This adds a new layer of complexity for chip designers."
TSMC has announced two new chip manufacturing nodes: the A13, aimed at AI chips and expected to enter production in 2029, and the N2U, a cost-effective option for phones and laptops, set for production in 2028. Both nodes will utilize existing ASML EUV machines instead of the more expensive High-NA EUV variant. TSMC emphasizes efficiency and plans to enhance AI chip performance by combining multiple chips into single packages, despite the challenges posed by heat generation and material expansion during use.
Read at Techzine Global
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