TSMC is fully committed to placing orders for advanced processes and advanced packaging in order to cope with the huge order demand from major cloud service companies, the Chinese language newspaper wrote.
Nvidia uses TSMC's 4nm process and Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging in its H100 chips. AMD's MI200 series AI accelerators utilize TSMC's 5 and 6nm processes.
TSMC is expected to produce CoWoS at a monthly rate of between 45,000 to 50,000 units by the end of the year.
Dan Nystedt, an analyst who focuses on semiconductor companies, estimated that AMD was also among TSMC's top 10 customers in terms of revenue.
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