#ai-chip-capex

#ai-chip-capex

"This is where I think our R&D has done exceptionally well in terms of leveraging existing EUV technology while setting an aggressive technology scaling roadmap," says Kevin Zhang, deputy co-chief operations officer and senior vice president at TSMC. "This is definitely a strength."

During prompt processing, the H100s were running at 92% compute utilization. Tensor cores fully saturated. Exactly what you want to see on a $30K GPU.

SK Hynix has reportedly broken ground on a new advanced memory packaging facility in West Lafayette, Indiana, that should boost the supply of US-made high-bandwidth memory (HBM), a key component in high-end AI accelerators from the likes of Nvidia and AMD.