"SK Hynix has reportedly broken ground on a new advanced memory packaging facility in West Lafayette, Indiana, that should boost the supply of US-made high-bandwidth memory (HBM), a key component in high-end AI accelerators from the likes of Nvidia and AMD."
"The facility will also house an R&D facility where SK Hynix will develop future generations of chips. According to industry watchers at TrendForce, the facility is unlikely to begin full-scale operations until the second half of 2028."
"While SK's new plant in Indiana should help to bolster supply of US-made HBM, the plant will come online too late to offer much if any relief from the current memory shortage, which is expected to peak later this year."
SK Hynix has started construction on a new advanced memory packaging facility in West Lafayette, Indiana, aimed at enhancing the supply of US-made high-bandwidth memory (HBM). This facility, costing nearly $4 billion, is expected to be completed by late 2027 and will also include an R&D center for future chip development. Currently, most HBM is produced in Korea, with Micron as the main US supplier. The Indiana plant will not alleviate the current memory shortage but will support growing US semiconductor manufacturing capacity.
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