"Intel's packaging is a 'very big differentiator' from competitors, according to CEO Lip-Bu Tan, highlighting the company's strategic focus on advanced chip packaging amid rising AI demand."
"Chief financial officer Dave Zinsner noted that revenue from packaging is expected to come in even before meaningful wafer revenue, indicating strong growth potential in this area."
Intel is revitalizing its Rio Rancho, New Mexico chip plant, particularly Fab 9, with significant investments, including $500 million from the US CHIPS Act. The company is focusing on advanced chip packaging, which combines multiple chiplets onto a single chip. This sector is experiencing growth as demand for custom chips rises due to AI. Intel aims to differentiate itself from competitors like Taiwan Semiconductor Manufacturing Corporation and anticipates substantial revenue growth from packaging, projecting earnings to exceed $1 billion.
Read at WIRED
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