Apple is reportedly collaborating with Broadcom to develop a custom server processor for AI features, codenamed 'Baltra,' anticipated to launch in 2026.
Craig Federighi mentioned earlier that Apple will leverage both device chips and cloud servers for its Intelligence features, indicating a dual architecture for AI.
Broadcom's newly designed optical interconnect chips enhance chip-to-chip communication speed, which could play a crucial role in Apple's plans for AI.
Broadcom offers a blueprint with its 3.5D technology to create multi-die processors similar to AMD's MI300X, expanding capabilities for high-performance AI tasks.
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