At TSMC's annual Open Innovation Platform, the emphasis shifted from raw hardware power to efficiency and collaboration, driven by the need for innovation in chip design.
TSMC's OIP, with 70,000 IP blocks, is crucial for interoperability in the semiconductor industry, showcasing the importance of mutual support among chip developers.
The industry is evolving beyond Moore's Law, requiring more innovative approaches such as AI-driven design to maintain competitive performance in chip manufacturing.
3Dblox represents a significant advancement in chip design by enabling teams to work more efficiently on three-dimensional architecture without the complications of translation errors.
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