Rick Cassidy, TSMC’s U.S. division president, shared that the yield of usable chips from their Phoenix plant is 4 percentage points higher than similar facilities in Taiwan, showcasing significant progress in their U.S. operations. This success in production yields not only indicates effective operations but also reflects the potential to lower the substantial costs associated with semiconductor manufacturing, highlighting TSMC's commitment to revamping the U.S. semiconductor landscape.
CEO C.C. Wei noted on a recent call with investors that the first fab of TSMC in Arizona entered engineering wafer production in April using 4-nanometer process technology and achieved a 'very good yield'. This accomplishment marks an important operational milestone for TSMC, reaffirming their robust manufacturing capabilities and execution, which is crucial for their clients like Nvidia and Apple, as well as the broader U.S. semiconductor revival.
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