"According to Jun, this feedback shows that Samsung is once again competing in the highest segment of memory technology, laying the foundation for a leading role in the AI era. The CEO, who also heads the Device Solutions division, looked back on the past year. He pointed to the recovery of HBM activities, the increase in foundry orders, and the acquisition of new international customers for image sensors."
"Jun underscored Samsung's strategic position as a semiconductor company. He stated that Samsung is the only player worldwide with an integrated offering that combines logic, memory, foundry services, and advanced packaging. This combination should enable Samsung to respond to the rapidly growing demand for AI chips in collaboration with its customers."
"Analysts point out that Samsung has already penetrated the supply chains of major customers with HBM3E in 2025, including Nvidia, AMD, and Broadcom. As a result, expectations for HBM4 deliveries have become more positive. Foundry activities were also discussed. Jun indicated that this branch is entering a phase of acceleration thanks to orders from major international customers. He acknowledged that there are still technical shortcomings, but sees opportunities if Samsung mana"
Customers are responding positively to HBM4, positioning Samsung back in the highest segment of memory technology and laying the foundation for a leading role in the AI era. HBM activities recovered, foundry orders increased, and new international image sensor customers were acquired. The company aims to fully regain technological leadership, which requires a clear lead over competitors and sustained investment. Samsung offers a unique integrated combination of logic, memory, foundry services, and advanced packaging, enabling collaboration with customers to meet growing AI chip demand. Analysts report HBM3E supply-chain penetration in 2025, and foundry operations are entering an acceleration phase despite technical shortcomings.
Read at Techzine Global
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