Intel has launched its second-generation AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC) at the Auto Shanghai International Automobile Industry Exhibition. This SoC, noted for its multi-node chiplet architecture, aims to meet the increasing demands of intelligent vehicles by providing automakers with customizable compute, graphics, and AI functionalities. The new architecture promises substantial performance improvements, such as up to 10x in AI performance and significant graphics enhancements, all while reducing development costs and accelerating time to market. Strategic partnerships with ModelBest and Black Sesame Technologies further aim to bolster development in AI and integrated driving technologies.
The newly unveiled Intel AI-enhanced software-defined vehicle system-on-chip features a revolutionary multi-process node chiplet architecture, boosting performance for automakers.
Intel’s second-generation SDV SoC introduces a chiplet-based architecture that dramatically improves AI performance and provides flexibility for automakers.
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