IBM details upcoming chips to support AI on mainframes
Briefly

IBM's new Telum II processor, unveiled at Hot Chips 2024, promises enhanced AI acceleration and increased cache size, set to improve mainframe performance significantly.
At the conference, IBM showcased the Spyre AI Accelerator alongside the Telum II, designed for greater scale AI inferencing, expected with next-generation IBM Z systems in 2025.
The Telum II processor features a higher clock speed of 5.5GHz and a 40 percent larger cache, with a significant jump in on-chip processing capabilities.
With around 70% of global transactions processed on IBM mainframes, the introduction of these advanced processors aims to integrate generative AI into essential financial workloads.
Read at Theregister
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