#semiconductor-packaging

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#hbm4e #samsung-memory #ai-memory #high-bandwidth-memory #ai-inference-chips #wafer-scale-computing
Mobile UX
fromGSMArena.com
12 hours ago

Samsung is now shipping samples of HBM4E memory, which is faster and has higher capacity

HBM4E increases HBM4 capacity and bandwidth while reducing power use and thermal resistance in a 12-layer design.
Silicon Valley
fromTechCrunch
1 week ago

$60B AI chip darling Cerebras almost died early on, burning $8M a month | TechCrunch

Cerebras nearly failed in 2019 after burning nearly $200 million, but solved a packaging challenge to build wafer-scale AI inference chips.
fromTechRepublic
1 month ago

Samsung Eyes Vietnam for $4B Semiconductor Packaging Project

The ministry is coordinating with other ministries and agencies to finalise and submit to the Prime Minister the Memorandum of Understanding between the Government of Vietnam and Samsung Group regarding the group's semiconductor manufacturing project in Vietnam.
European startups
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