Huawei Mate 70 series to have familar camera design, leak reveals
Huawei Mate 70 lineup will revive familiar design while significantly improving camera technology and processing power using a new Kirin chipset.
Motorola Edge 50 Neo pops up on retailer websites, confirms Pantone palette
Motorola's Edge 50 Neo offers significant hardware improvements with a new chipset and enhanced camera system targeting the mid-range market.
Oppo Find X8 series to bring brighter displays, Pro variant returns
Oppo is set to release Find X8, Find X8 Pro, and Find X8 Ultra, with improved displays and different chipsets, potentially launching earlier than usual.
Deals: repairable phones, the Moto Edge 50 Pro and the Poco F6/F6 Pro
Fairphone 5 aims for 7 years of OS updates, HMD Skyline offers better display and camera specs, while Motorola Edge 50 Pro is more affordable with faster chipset.
Xiaomi 15 Pro specs leak, variable aperture is gone from the main camera
Xiaomi will be the first to use Qualcomm's Snapdragon 8 Gen 4 SoC in their Xiaomi 15 and Xiaomi 15 Pro smartphones, expected to be unveiled in October.
Huawei Mate 70 series to have familar camera design, leak reveals
Huawei Mate 70 lineup will revive familiar design while significantly improving camera technology and processing power using a new Kirin chipset.
Motorola Edge 50 Neo pops up on retailer websites, confirms Pantone palette
Motorola's Edge 50 Neo offers significant hardware improvements with a new chipset and enhanced camera system targeting the mid-range market.
Oppo Find X8 series to bring brighter displays, Pro variant returns
Oppo is set to release Find X8, Find X8 Pro, and Find X8 Ultra, with improved displays and different chipsets, potentially launching earlier than usual.
Deals: repairable phones, the Moto Edge 50 Pro and the Poco F6/F6 Pro
Fairphone 5 aims for 7 years of OS updates, HMD Skyline offers better display and camera specs, while Motorola Edge 50 Pro is more affordable with faster chipset.
Xiaomi 15 Pro specs leak, variable aperture is gone from the main camera
Xiaomi will be the first to use Qualcomm's Snapdragon 8 Gen 4 SoC in their Xiaomi 15 and Xiaomi 15 Pro smartphones, expected to be unveiled in October.
Snapdragon 8 Elite enhances mobile performance with a powerful CPU, GPU, and optimized AI capabilities, setting new standards for Android flagship devices.
Qualcomm silently introduces Snapdragon 6 Gen 3
Qualcomm's Snapdragon 6 Gen 3 improves mid-range AI performance and features over its predecessor, but retains many aspects from the Snapdragon 7s Gen 2.
Snapdragon 7s Gen 3 leaks with a much faster GPU, CPU will get a boost as well
Qualcomm's upcoming Snapdragon 7s Gen 3 chip is set to offer notable performance improvements and enhanced AI capabilities, targeting mid-range devices.
Qualcomm admits: the Snapdragon 6s Gen 3 is just an "enhanced version" of the Snapdragon 695
The Snapdragon 6s Gen 3 is essentially an improved version of the Snapdragon 695 chipset, offering enhancements in CPU, GPU, and AI performance.
Snapdragon 8 Elite enhances mobile performance with a powerful CPU, GPU, and optimized AI capabilities, setting new standards for Android flagship devices.
Qualcomm silently introduces Snapdragon 6 Gen 3
Qualcomm's Snapdragon 6 Gen 3 improves mid-range AI performance and features over its predecessor, but retains many aspects from the Snapdragon 7s Gen 2.
Snapdragon 7s Gen 3 leaks with a much faster GPU, CPU will get a boost as well
Qualcomm's upcoming Snapdragon 7s Gen 3 chip is set to offer notable performance improvements and enhanced AI capabilities, targeting mid-range devices.
Qualcomm admits: the Snapdragon 6s Gen 3 is just an "enhanced version" of the Snapdragon 695
The Snapdragon 6s Gen 3 is essentially an improved version of the Snapdragon 695 chipset, offering enhancements in CPU, GPU, and AI performance.
Honor X7c listed in Kazakhstan ahead of official unveiling
Honor X7c reveals detailed specs ahead of launch, but inconsistencies in display size and chipset raise questions.
Weekly poll results: the Motorola Edge 50 Neo can be a hit, especially if the price drops a bit
Motorola finds a niche with Edge 50 Neo despite some criticisms regarding size and chipset.
Consumer interest grows, contingent on detailed reviews ahead of final decisions.
MediaTek Dimensity 8250 unveiled: a reworked Dimensity 8200
The Dimensity 8250 chipset is a refreshed version, maintaining its mid-range status with updated features like a Mali-G610 GPU and support for quad-channel LPDDR5 RAM.
Honor X7c listed in Kazakhstan ahead of official unveiling
Honor X7c reveals detailed specs ahead of launch, but inconsistencies in display size and chipset raise questions.
Weekly poll results: the Motorola Edge 50 Neo can be a hit, especially if the price drops a bit
Motorola finds a niche with Edge 50 Neo despite some criticisms regarding size and chipset.
Consumer interest grows, contingent on detailed reviews ahead of final decisions.
MediaTek Dimensity 8250 unveiled: a reworked Dimensity 8200
The Dimensity 8250 chipset is a refreshed version, maintaining its mid-range status with updated features like a Mali-G610 GPU and support for quad-channel LPDDR5 RAM.
Mediatek officially announces Dimensity 9400 with a 3.63 GHz CPU
The Mediatek Dimensity 9400 chipset delivers exceptional CPU and GPU performance enhancements built on advanced 3 nm technology, incorporating innovative AI capabilities.
MediaTek's new flagship chipset is ready for AI agents and tri-fold phones
MediaTek's Dimensity 9400 is a powerful, energy-efficient chipset with advanced AI features, set to launch in Q4 of this year.
Mediatek reveals date for Dimensity 9400 arrival
Mediatek will unveil its flagship Dimensity 9400 chipset on October 9, promising significant enhancements in performance and capabilities.
MediaTek Dimensity 9400 key specs tipped
MediaTek to launch Dimensity 9400 chipset in Q4 with 3nm node for lower power consumption.
Mediatek officially announces Dimensity 9400 with a 3.63 GHz CPU
The Mediatek Dimensity 9400 chipset delivers exceptional CPU and GPU performance enhancements built on advanced 3 nm technology, incorporating innovative AI capabilities.
MediaTek's new flagship chipset is ready for AI agents and tri-fold phones
MediaTek's Dimensity 9400 is a powerful, energy-efficient chipset with advanced AI features, set to launch in Q4 of this year.
Mediatek reveals date for Dimensity 9400 arrival
Mediatek will unveil its flagship Dimensity 9400 chipset on October 9, promising significant enhancements in performance and capabilities.
MediaTek Dimensity 9400 key specs tipped
MediaTek to launch Dimensity 9400 chipset in Q4 with 3nm node for lower power consumption.
Google Pixel 9 Pro Fold hands-on: A clever new shape and even bigger displays
The Pixel 9 Pro Fold is Google's latest flexible-screen phone with a revamped design and significant improvements, including a large 8-inch flexible screen and a powerful chipset.
Leaked Samsung Galaxy A06 images show a familiar design
The upcoming Samsung Galaxy A06 is expected to use the same chipset as A05 and feature a similar design with a pinstripe pattern on the back.
Nothing Phone (2a) leaks in hands-on images
Upcoming Phone (2a) from Nothing is expected to launch soon
Live images of the device have been leaked
Complete Samsung Galaxy Z Fold6 spec sheet leaks
Samsung Galaxy Z Fold6 spec sheet leaked, revealing major changes in size, display, chipset, and cameras.
Google Pixel 9 Pro Fold hands-on: A clever new shape and even bigger displays
The Pixel 9 Pro Fold is Google's latest flexible-screen phone with a revamped design and significant improvements, including a large 8-inch flexible screen and a powerful chipset.
Leaked Samsung Galaxy A06 images show a familiar design
The upcoming Samsung Galaxy A06 is expected to use the same chipset as A05 and feature a similar design with a pinstripe pattern on the back.
Nothing Phone (2a) leaks in hands-on images
Upcoming Phone (2a) from Nothing is expected to launch soon
Live images of the device have been leaked
Complete Samsung Galaxy Z Fold6 spec sheet leaks
Samsung Galaxy Z Fold6 spec sheet leaked, revealing major changes in size, display, chipset, and cameras.