The XMC-2400 µCooling chip represents a breakthrough by integrating solid-state speaker driver technology into cooling solutions, offering incredibly thin and efficient cooling for compact devices.
Mike Housholder stated, "Weighing under 150 milligrams and capable of moving up to 39 cubic centimeters of air per second, our solid-state micro-cooling chip is a game changer for device cooling."
xMEMS' micro-cooling technology allows for direct placement on heat-generating components, enhancing performance while ensuring devices like smartphones and tablets remain slim and overheating issues are minimized.
By utilizing ultrasonic modulation to create pressure pulses, the xMEMS chip avoids traditional fan failures, making it a reliable option for maintaining optimal temperatures in electronic devices.
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