"For now, Samsung can sell this stuff in capacities between 24 and 36 gigabytes, but already plans to reach 48GB. Memory is so hot right now, but Samsung claims it has enhanced thermal resistance by 10 percent and heat dissipation by 30 percent, compared to HBM3E. The company also claims this new memory is 40 percent more energy efficient, meaning this kit uses less electricity and runs cooler, suggesting users can look forward to slower growth in their energy bills."
"Speaking at an event hosted by Wolfe Research, Micron CFO Mark Murphy decided to "address some recent inaccurate reporting by some on our HBM4 position" by revealing the company has also started high-volume HBM4 production and shipped some to customers. "Our HBM yield is on track. Our HBM4 yield is on track. Our HBM4 product delivers over 11 gigabits per second speeds, and we're highly confident in our HBM4 product performance and quality and reliability," he said, adding that Micro"
Samsung has begun mass production of HBM4 and shipped units to an unnamed customer, with likely use in Nvidia's forthcoming Vera Rubin kit. The memory delivers a consistent 11.7 gigabits-per-second and can reach 13Gbps; a single stack offers up to 3.3 terabytes-per-second bandwidth. Initial capacities span 24–36GB with plans for 48GB. Samsung reports 10% improved thermal resistance, 30% better heat dissipation, and 40% greater energy efficiency versus HBM3E. Samsung did not disclose pricing but projects HBM sales will more than triple in 2026 and plans HBM4E samples in H2 2026. Micron also reports high-volume HBM4 production, shipping, and yields on track with over 11Gbps performance.
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