Inspur's new memory cooling technology significantly improves heat dissipation efficiency by utilizing a novel 'sleeper architecture' design that facilitates easier maintenance and installation.
The solution draws inspiration from the design of railway sleepers. A memory module features aluminum heat sinks and heat pipes, enhancing heat transfer without the complexity of traditional cooling methods.
This new approach allows each memory module to have a separate heat dissipation aluminum sheet, improving the convenience of hot-swapping a single memory unit without impacting others.
As workloads driven by AI pack servers with memory, traditional air cooling fails to meet the demands of modern high-density server architecture, necessitating innovative cooling solutions.
#memory-cooling-technology #ai-server-infrastructure #thermal-management #inspur-innovations #server-manufacturing
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