Samsung introduced a new LPDDR5X DRAM chip, the thinnest in its category, targeting smartphones with on-device AI capabilities.
The 0.65mm thick chip, 9% thinner than its predecessor, is designed to improve cooling efficiency by 21.2%.
The new chip, created using optimized PCB and epoxy molding techniques, is built in a 4-stack structure with layers of LPDDR DRAMs.
Samsung is already shipping the 12 GB and 16 GB packages and plans to develop even thinner 24 GB and 32 GB modules for future devices.
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