"Besi is seeing a particularly strong increase in demand for hybrid bonding, a technique that allows chips to be placed closer together and work more efficiently."
"The order intake also continued to rise, indicating sustained strong market demand, with order intake more than doubling and thus exceeding analysts' expectations."
"Hybrid bonding systems enable chips to be connected directly via microscopic copper bonds, allowing data to be exchanged more quickly while reducing energy consumption."
"Besi is scaling up its production capacity, expanding production of more standardized systems in Vietnam and creating new facilities in Malaysia."
Besi is benefiting from rising investments in AI infrastructure, particularly through hybrid bonding technology, which enhances chip efficiency. In the first quarter, revenue reached 185 million euros, with profit growing to 52 million euros. Order intake has more than doubled annually, surpassing analyst expectations. CEO Richard Blickman notes the market recovery, emphasizing hybrid bonding's role in next-generation AI chips. The company anticipates continued revenue growth and improved margins, driven by strong demand and a shift towards advanced assembly techniques as lithography limits are reached.
Read at Techzine Global
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