A group of Chinese semiconductor firms, including Huawei, are reportedly looking to get domestic production of high bandwidth memory (HBM) up and running by 2026, with support from the Chinese government.
Huawei's leadership in the consortium is evident as the HBM chips are optimized for their products, with plans to be the largest buyer, benefiting the Chinese AI industry.
HBM, despite being more expensive than GDDR6, is favored for high-margin GPUs and AI processors due to its higher bandwidth, crucial for China's AI industry growth amid US sanctions.
CXMT, also investing in HBM manufacturing, might operate independently of Huawei due to US export license concerns with Huawei, potentially impacting its prior generation memory operations.
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