#hybrid-bonding

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Gadgets
fromGSMArena.com
3 weeks ago

Samsung expects high demand for memory chips this year and next, reveals new designs

Demand for Samsung's memory chips and HBM4 will remain high through 2027 due to unprecedented AI hyperscaler orders, driving higher prices and mass production.
Tech industry
fromTechzine Global
1 month ago

BE Semiconductor sees revenue increase by 43 percent

Besi's Q4 orders rose 43% to €250m, driven by Asian demand, photonics and hybrid bonding, prompting an upgraded profit outlook and strong share gains.
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