"Chip equipment manufacturer BE Semiconductor Industries, based in Duiven in the province of Gelderland, saw its order revenue rise by 43 percent to €250 million in the fourth quarter. The company now expects to exceed its previously issued profit forecast. BE Semiconductor, or Besi for short, is benefiting primarily from increased demand from Asia. The expansion of chip production for data centers continues to rise, with players such as Besi benefiting directly from this."
"Besi's equipment is used to handle complex processes in chip production, such as the microscopic connection of components within semiconductors. This is referred to as "packaging" for short, and the specific connection of chip components usually takes place via hybrid bonding. This involves the most advanced assembly of the most valuable modern chips. These chips, such as Nvidia and AMD GPUs, use hybrid bonding technology to maximize the speed between components (particularly between logic-the computing power-and the memory that surrounds it)."
BE Semiconductor Industries (Besi) recorded a 43% increase in Q4 order revenue to €250 million and now expects to exceed its prior profit forecast. Asian demand and rising chip production for data centers drove the uplift, supported by new photonics purchases and anticipated hybrid bonding orders. Besi's systems perform microscopic packaging and hybrid bonding to connect semiconductor components, enabling high-performance chips such as Nvidia and AMD GPUs to maximize speed between logic and memory. Shares climbed 6.9% to €161.30, the chip equipment market grew 18.1% in 2024, and DRAM shortages for HBM remain a constraint.
Read at Techzine Global
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