fromTheregister
1 hour agoAyar Labs eyes hyperscale customers with GUC design collab
The idea is that rather than using copper interconnects, which have limited reach and often require the use of costly retimers, Ayar's TeraPHY photonic chiplets can be co-packaged alongside compute dies, enabling more than 200 Tbps of aggregate bandwidth for chip-to-chip communications. If Ayar and GUC can deliver on this design point, that'd make XPUs based on the tech more than 10 times faster than the fastest interconnects today, which top out at 14.4 Tbps.
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