#multi-die-packaging

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Tech industry
fromtheregister
2 days ago

Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire

FuriosaAI will build Broadcom-based third-gen AI inference accelerators using multi-die packaging, 2nm fabrication, HBM4/4e memory, and Ethernet/PCIe scaling beyond eight chips.
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