"Memory makers just can't churn out their DRAM fast enough. On the heels of an AI-driven shortage, SK Hynix on Tuesday announced a new 19 trillion Korean won (about $13 billion) advanced packaging and test facility in South Korea that could offer some relief - just not for consumer products like laptops and phones. The South Korean memory giant unveiled the new site, dubbed P&T7, which will be located at the Cheongju Technopolis Industrial Park in Chungbuk, South Korea."
"The process is incredibly expensive, as a single defect in any of the layers could render the final module worthless. Worse, because of HBM's prodigious data rates - as high as 2.75 TB/s per module in the latest generations - the chips usually need to be permanently co-packaged alongside the compute logic. This makes the margin incredibly tight. Defective modules could scrap a $50,000 GPU."
SK Hynix will build a 19 trillion won advanced packaging and test facility (P&T7) at Cheongju Technopolis in Chungbuk, with work starting in April and targeted completion by the end of 2027. The plant aims to scale production of high-bandwidth memory (HBM) modules used in datacenter GPUs and AI accelerators to meet expected 33 percent annual demand growth between 2025 and 2030. HBM stacks multiple DRAM layers, commonly eight or 12, to increase capacity and bandwidth while reducing energy consumption. Manufacturing is costly because single-layer defects can ruin modules, and high data rates require permanent co-packaging with compute logic, tightening margins. P&T7 will complement the M15X DRAM fab.
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