Intel CFO swears big Foundry wins coming soon

"We've gotten really good engagement from customers on this business. We're close to closing some deals that are in the billions of dollars per year in terms of revenue. Advanced packaging has become a focal point of semiconductor manufacturing amid the AI boom as accelerators have grown more complex, meaning many GPUs are composed of multiple compute and memory dies that must be fused together."

"Intel has invested heavily in its EMIB and Foveros 2.5D and 3D packaging tech to support multi-die processors like its Xeon CPUs and (now discontinued) Ponte Vecchio family of GPU Max accelerators. Perhaps more importantly, that tech isn't limited to chips Intel makes in its own fabs - the company has already used it to meld silicon manufactured in-house with chips made by TSMC."

"This is likely welcome news for shareholders, who've watched in dismay as Intel's Foundry Division has cost the company billions each quarter. Of course, there's no guarantee those deals will materialize, and even if they do, Intel will need to deliver on time."

Intel's Foundry division is nearing completion of deals worth billions of dollars annually for advanced packaging technology, according to CFO David Zinsner. Advanced packaging has become critical in semiconductor manufacturing due to AI accelerators requiring multiple compute and memory dies to be integrated together. Intel has invested in EMIB and Foveros 2.5D and 3D packaging technologies supporting multi-die processors like Xeon CPUs. The company can combine chips manufactured internally with those from TSMC using this technology. These deals represent significant revenue potential for the struggling Foundry division, though execution remains uncertain given Intel's historical delivery challenges. CEO Lip-Bu Tan has also reconsidered the external commercialization strategy for Intel's 18A process technology.

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