"Intel has begun clawing back production from TSMC with the introduction of its Panther Lake processors, the company's first chip based on its long-awaited 18A process tech. The x86 giant began volume production of the processor's compute tiles at Fab 52 located at its Ocotillo campus in Arizona this summer, with the first notebooks and computers based on the SoC slated for release around the time of CES early next year."
"Much of Panther Lake's efficiency and performance gains can be attributed to the chip's new process tech, which, in addition to a node shrink from Intel 3 to a 2 nm-class process it calls 18A, shifts power delivery to the back of the wafer. According to Intel, 18A's denser RibbonFet transistors account for more than a 15 percent increase in performance per watt, while backside power boosts transistor density by up to 30 percent."
Panther Lake compute tiles entered volume production at Fab 52 in Ocotillo, Arizona this summer, with notebooks and systems expected around CES. The design uses a 2 nm-class 18A process for the compute die, combining CPU, NPU, and image processors on that tile. Intel claims up to 10 percent single-thread and 50 percent multithread performance-per-watt gains versus Lunar and Arrow Lake. 18A employs denser RibbonFet transistors and backside power delivery, boosting performance-per-watt over 15 percent and transistor density by up to 30 percent. Panther Lake remains heterogeneous: platform controller and GPU tiles use TSMC or Intel 3 depending on SKU, all integrated via Foveros packaging.
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