Samsung and the Johns Hopkins University Applied Physics Laboratory co-developed a next-generation Peltier cooling technology that received a 2025 R&D 100 award recognizing top global innovations. Engineers applied nanotechnology and thermoelectrics research to improve a semiconductor-based Peltier device that cools without traditional refrigerants. The work increased efficiency by up to 75% while reducing required material to 0.1% of previous generations. The reduced size and weight enable future deployment in cars, data centers, homes, and offices with lower environmental impact. Samsung first demonstrated a Peltier cooling device in its AI Hybrid Refrigerator shown at IFA.
Samsung's next-generation Peltier cooling technology, co-developed with the Johns Hopkins University Applied Physics Laboratory, has received a 2025 R&D 100 award, which is apparently often referred to as the Nobel Prize of Engineering and the Oscars of Innovation. The award is handed out by R&D World Magazine and recognizes the world's 100 most innovative technologies each year. The Peltier cooling tech was first unveiled earlier this year in a publication in the science journal Nature Communications.
Samsung engineers worked with Dr. Rama Venkatasubramanian's thermoelectrics research team using nanotechnology to improve the efficiency and performance of a Peltier device, which uses a semiconductor material for cooling instead of traditional refrigerants, that can be harmful to the environment. This research has improved the efficiency of Peltier devices by up to 75% while requiring only 0.1% of the material compared to the previous generation.
This research has improved the efficiency of Peltier devices by up to 75% while requiring only 0.1% of the material compared to the previous generation. This should, in the future, allow for small, lightweight cooling devices that are environmentally friendly. In a probably not very near future, this could be used to cool cars, data centers, homes, offices, and more. Samsung has first used a Peltier cooling device in its AI Hybrid Refrigerator which was shown at IFA last year.
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