Samsung is reportedly planning a packaging change for the Exynos 2700 flagship SoC. The company may move away from Fan-Out Wafer-Level Packaging (FOWLP), which has been used since the Exynos 2400 and has improved thermal performance, but is described as complex and costly to manufacture and less profitable. For the Exynos 2700, Samsung is expected to adopt a Side-by-Side (SbS) architecture that places the application processor (AP) and DRAM next to each other on the substrate rather than stacking them. Samsung is also expected to integrate its Heat Pass Block (HPB) technology to enhance heat dissipation and thermal efficiency. The chipset is expected to appear in Galaxy S27 and Galaxy S27+ in early 2027.
"The company is also expected to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which could help improve heat dissipation and overall thermal efficiency. Samsung is expected to use the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are likely to launch in early 2027."
Read at GSMArena.com
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