Oppo is set to launch its new Find X8 series in April, with the Find X8S boasting an ultra-thin bezel design, reportedly '1.xx mm' thick, achieved through a new Chip-on-Panel (COP) technology. This innovation integrates the display driver chip directly into the screen, significantly reducing bezel size and enhancing energy efficiency. However, it is more complex and costly to manufacture. Alongside the Find X8S, Oppo plans to unveil additional models including the Find X8S+ and the highly anticipated Find X8 Ultra with five cameras.
The Find X8S will feature an ultra-thin bezel measuring '1.xxmm,' achieved with innovative COP technology, making it thinner than Apple's iPhone 16 Pro Max.
Oppo's new COP packaging allows for a more energy-efficient design by integrating the display driver chip directly into the screen, reducing overall bezel size.
Expect the upcoming Oppo launch to reveal not just the Find X8S but also a Mini version, the X8S+, and the ultra model featuring five cameras.
While the COP technology offers impressive aesthetics and energy savings, it is also more complex and costlier to produce than traditional display technologies.
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