Huawei is advancing its semiconductor capabilities, focusing on the development of a true 5 nm production line without relying on EUV lithography, which is restricted due to patents held by ASML. Leveraging SSA800 lithography machines from Shanghai Micro Electronics, Huawei is concurrently working on 3 nm chips that utilize GAA architecture and an innovative carbon nanotube approach. Despite difficulties, including production yield issues with current designs, Huawei continues to push the boundaries of chip technology, exemplified by the recent launch of the Kirin X90 chipset in the Matebook Fold that combines advanced packaging with efficient performance.
Huawei's new production line aims to create true 5 nm chips without EUV machines, challenging existing limitations due to international constraints on their technology.
Using SSA800 lithography, Huawei is innovating in chip production, and has already begun R&D for 3 nm technology through two distinct approaches, including carbon nanotube architecture.
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