Details for mid-range Kirin 8030 chipset leak, show higher clock speeds than the 8020
Briefly

Details for mid-range Kirin 8030 chipset leak, show higher clock speeds than the 8020
"The Kirin 8030 is said to be built on SMIC's N+2 node, which is a 7nm FinFET node. Yes, that's years behind the cutting edge, but keep in mind that SMIC and Huawei are basically having to re-invent the whole semiconductor industry. While it's an old node, Huawei has managed some impressive clock speed improvements. The CPU on the Kirin 8030 will use in-house Taishan cores: 1x super large core at 2.8-3.0GHz + 3x medium at 2.4-2.6GHz + 4x small cores at 1.8-2.0GHz."
"For comparison, here's the breakdown of the Kirin 8020 CPU: 1x super large at 2.28GHz + 3x medium at 2.05GHz and 4x small cores at just 1.3GHz. There's only so much that can be done on such a large node, though - the Kirin 8030 is described as having single-core performance similar to the Snapdragon 888 and higher multi-core performance. To be fair, the main issue with the 888 was power draw, not performance. And the 888 was fabbed on a 5nm Samsung node."
"Anyway, the new chipset will probably use a Maleoon GPU and will target 100-120fps in select games. It's not clear which games those might be, however. The Kirin 8030 is a new design, so it will benefit from some new tech - like Huawei's Barong 5G modem (with support for sub-6GHz and mmWave) and a powerful Leonardo da Vinci NPU that is said to be closer to the Snapdragon 8 Gen 2 in terms of performance than the 888."
The Kirin 8030 targets mid-range Huawei nova and Enjoy phones and is fabricated on SMIC's N+2 7nm FinFET node. The CPU adopts in-house Taishan cores in a 1+3+4 configuration with clocks of 2.8–3.0GHz, 2.4–2.6GHz, and 1.8–2.0GHz, improving substantially over the Kirin 8020. Reported single-core performance matches the Snapdragon 888 while multi-core performance is higher. The chipset likely pairs a Maleoon GPU aimed at 100–120fps in select games, integrates a Barong 5G modem with sub‑6GHz and mmWave support, and includes a Leonardo da Vinci NPU approaching Snapdragon 8 Gen 2 performance. SMIC also began N+3 (5nm) volume production without EUV.
Read at GSMArena.com
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