"The XT:260 is intended for use in 3D integration processes, such as the production of interposers that assemble multiple chiplets. The scanner uses i-line lithography with a wavelength of 365 nanometers and a resolution of approximately 400 nanometers. The production speed is around 270 wafers per hour, which is up to 4 times higher than that of existing packaging solutions. With this, ASML aims to reduce the gap between front-end lithography and back-end processes that connect and package chips."
"The XT:260 had already been announced earlier. During ASML's Investor Day in November 2024, Herman Boom, head of the DUV division, said that the machine would be shipped later in 2025. He explained at the time that the system reduces the pattern on the masks twice rather than four times, enabling it to scan an exposure field of 26 by 33 millimeters. This larger field makes the system suitable for packaging applications, where larger surfaces are often exposed."
ASML delivered its first TWINSCAN XT:260 to a customer, targeting advanced packaging and 3D integration such as interposers and chiplet assembly. The XT:260 uses i-line lithography at 365 nanometers, offers roughly 400 nanometer resolution, and achieves about 270 wafers per hour—up to four times faster than existing packaging solutions. The system is designed to narrow the gap between front-end lithography and back-end packaging processes. CEO Christophe Fouquet emphasized growing importance of advanced packaging and noted that technologies from existing scanners can be applied to the new system. The company did not disclose the customer and is exploring more sustainable deliveries.
Read at Techzine Global
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