"The phone is going to be powered by the Snapdragon 8 Elite 2 chipset, which Qualcomm is announcing in September. It will boast an upgraded built-in cooling fan, which will allow it to have an IP68 dust and water resistance rating. The combination of an active fan and an IP rating was pioneered last month by the Oppo K13 Turbo and K13 Turbo Pro, but those two are only water resistant."
"The RedMagic 11 is coming later this year, and today in China some details about it have been outed. The RedMagic 11 will be the first ever smartphone to have an active cooling fan as well as both water and dust resistance. While this information was leaked by Digital Chat Station on Weibo, RedMagic's General Manager Jiang Chao has confirmed it, so it's official now."
RedMagic 11 will launch later this year and will be powered by Qualcomm's Snapdragon 8 Elite 2 chipset, announced in September. The device will include an upgraded built-in cooling fan designed to enable an IP68 dust and water resistance rating. The combination of an active fan and an IP rating was recently introduced by the Oppo K13 Turbo models, which only offer water resistance. RedMagic 11 will be the first smartphone to combine an active cooling fan with both water and dust resistance. The leak originated on Weibo via Digital Chat Station and has been confirmed by RedMagic General Manager Jiang Chao.
Read at GSMArena.com
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