"The Realme GT 7, launching on May 27, features an innovative IceSense graphene back for superior heat dissipationâup to 6°C lower chipset temperatures compared to copper."
"With a cutting-edge 7700mm heat dissipation system and the advanced Dimensity 9300+ chipset, the Realme GT 7 promises exceptional cooling performance and speed."
Realme is set to launch the GT 7 globally on May 27 in Paris, boasting an IceSense graphene back designed for enhanced cooling. The device promises significantly improved heat dissipationâRealme claims up to a 6°C reduction in chipset temperature compared to traditional systems. Alongside an impressive 7700mm heat dissipation system, it will be equipped with the advanced Dimensity 9300+ chipset. These features position the GT 7 as a competitive flagship device, mirroring the specifications of its Chinese counterpart released the previous month.
Read at GSMArena.com
Unable to calculate read time
Collection
[
|
...
]