Realme is set to launch the GT 7 globally on May 27 in Paris, boasting an IceSense graphene back designed for enhanced cooling. The device promises significantly improved heat dissipation—Realme claims up to a 6°C reduction in chipset temperature compared to traditional systems. Alongside an impressive 7700mm heat dissipation system, it will be equipped with the advanced Dimensity 9300+ chipset. These features position the GT 7 as a competitive flagship device, mirroring the specifications of its Chinese counterpart released the previous month.
The Realme GT 7, launching on May 27, features an innovative IceSense graphene back for superior heat dissipation—up to 6°C lower chipset temperatures compared to copper.
With a cutting-edge 7700mm heat dissipation system and the advanced Dimensity 9300+ chipset, the Realme GT 7 promises exceptional cooling performance and speed.
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