"At the center of it all is the industry's first Dual Piezoelectric Ceramic Single Pump, which uses electric current to drive high-frequency deformation of piezoelectric ceramics, driving fluorinated liquid at a high-speed flow rate of up to 6.5 ml/min, which is double the speed of conventional active liquid cooling systems. The liquid cooling channels cover 100% of the mainboard's core heat sources for "unprecedented cooling precision and efficiency", the official press release says."
"To amplify this even further, Infinix is also introducing the world's first piezoelectric fan technology for smartphones, which uses a 0.1mm ultra-thin vibrating sheet that pulses 25,000 times per second, creating a high-pressure, turbulent air jet that drives over ten times greater heat dissipation than traditional spinning blades. This fan operates in near silence thanks to its solid-state structure and lack of blades, ensuring a more comfortable user experience."
"The brand has also revealed an industry-first split gaming controller, featuring a large pressure-sensitive touchpad and ultra-low-latency, along with wireless magnetic triggers with "mouse-grade micro-switches". Infinix is no stranger to experimenting with color-changing backs - it demoed e-ink based solutions twice in 2024, for example. Today at CES it's introducing Active Visual Backplate technology, which uses precise optical microstructures to manipulate reflected light into a back panel design that changes with viewing angles and environments."
HydroFlow is an active liquid cooling system centered on the industry's first Dual Piezoelectric Ceramic Single Pump. The pump uses electric current to drive high-frequency deformation of piezoelectric ceramics and moves fluorinated liquid at up to 6.5 ml/min, double conventional speeds. Liquid channels cover 100% of mainboard core heat sources. A piezoelectric fan uses a 0.1mm vibrating sheet pulsing 25,000 times per second to produce a turbulent air jet and over ten times the heat dissipation of traditional fans while operating near silently. Future full-chamber immersive cooling will allow direct liquid contact with components. A split gaming controller and Active Visual Backplate complete the feature set.
Read at GSMArena.com
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