Imec and Ghent University have unveiled a fully integrated chip that merges optical and microwave signal processing on a single silicon chip. By combining high-speed modulators, optical filters, photodetectors, and transfer-printed lasers, this innovation promises enhanced signal processing efficiency and scalability. It addresses challenges in modern communication networks that suffer from complexity and limitations of current fiber-based microwave photonics systems. The chip is poised to advance applications in 5G/6G networks, satellite communications, and radar systems, facilitating high-frequency signal processing that is both compact and energy-efficient.
The ability to integrate all essential microwave photonics components on a single chip marks a major step toward scalable and energy-efficient high-frequency signal processing.
This breakthrough enables the processing of high-efficiency signals at higher bandwidths with improved energy efficiency, paving the way for more efficient 5G/6G networks.
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