"Huawei's latest server chip - the Kunpeng 930 is built on TSMC's 5nm architecture. The finding was revealed in a teardown video by @Kurnalsalts who shared a video of the process. The new chip should offer nearly 2x performance jump over its predecessor, though it is still a few generations away from the latest generation of Intel and AMD offerings."
"Kunpeng 930 features a CPU fabbed on TSMC's N5 process while the I/O die is presumably SMIC's 14nm process. The 77.5mm x 58.0mm chip features a dual-socket motherboard including a Mount TaiShan CPU architecture with each CPU die featuring 10 CPU clusters. Each of those clusters integrates 2 CPU cores, bringing the total count to 80 cores."
"In addition, each die inside the Kunpeng 930 features 91MB L3 cache and 2MB L2 cache support. The chip also brings 96 PCIe lanes with a 16-channel memory connection."
The Kunpeng 930 CPU die is fabricated on TSMC's N5 (5nm) process while its I/O die is likely produced on SMIC's 14nm node. The package measures 77.5mm by 58.0mm and supports dual-socket motherboards using the Mount TaiShan CPU architecture. Each CPU die contains 10 clusters with two cores per cluster, totaling 80 cores. Each die also provides 91MB of L3 cache and 2MB of L2 cache support. The chip exposes 96 PCIe lanes and a 16-channel memory interface. Performance targets approach roughly double the previous generation but lag the newest Intel and AMD server CPUs.
Read at GSMArena.com
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