""We have to solve these challenges of power and space and heat. It's not going to be solved by one thing, but one of those things is much more intelligent, multi-dimensional packaging.""
""Alongside its fab, Rapidus is also developing its own advanced packaging capability, which should enable it to compete with giants Samsung, TSMC, and Intel.""
""The speed at which the Japanese startup has managed to stand up its foundry biz is notable. Unlike Intel, which began its foundry journey just a year earlier, Rapidus is starting from scratch.""
Japan is revitalizing its semiconductor industry, led by Rapidus, which plans to begin mass production of 2nm chips by 2027. The company has made significant strides, including pilot production of 300mm wafers using advanced transistor technology. Rapidus is also developing advanced packaging capabilities to compete with major players like Samsung and TSMC. The startup's rapid establishment of its foundry business is noteworthy, as it aims to address challenges in power, space, and heat management in modern semiconductor assembly.
Read at Theregister
Unable to calculate read time
Collection
[
|
...
]