Huawei says it has developed LogicFolding to shorten its semiconductor capability gap with TSMC. Huawei expects to begin making 1.4-nanometer chips by 2031, while TSMC plans mass production of the same class in 2028. Huawei’s semiconductor chief He Tingbo said the approach enables sustainable evolution without using ASML extreme ultraviolet lithography machines. LogicFolding is described as increasing transistor counts and optimizing data transmission speed. The first Kirin mobile chips using the architecture are planned for release in the fall. Huawei’s announcement drove gains among Chinese chip firms, including SMIC and Hua Hong Semiconductor.
"Huawei will start making 1.4-nanometer chips by 2031 with its own "LogicFolding" technology, Huawei's semiconductor chief He Tingbo said in a rare public appearance during a chip conference on Monday, while TSMC has said that it will begin mass production of the same product in 2028."
"The executive said that her team has found a way for "sustainable evolution." She told reporters after her speech on Monday that Huawei can advance its chipmaking prowess significantly without the use of Dutch supplier ASML Holding NV's extreme ultraviolet lithography machines, widely considered as essential for production of cutting-edge semiconductors that China doesn't have access to."
"He added that the Kirin mobile chips to be launched this fall will be the first to adopt the LogicFolding architecture, which helps boost performance of a chip by increasing the number of transistors it carries and optimizing data transmission speed."
""This year we have prepared a surprise for the whole industry. Not saturation, not continuation, but a big leap ahead," she said. If Huawei can manage to make 1.4nm semiconductors in large quantities, it means it's defying the industry consensus that ASML's EUV lithography machines are necessary to mass-produce chips that are 5nm or more advanced."
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