Huawei to produce 1.4nm chips by 2031, comes up with a new scaling law for semiconductors

Huawei revealed advancements from the past six years, including a new architecture aimed at addressing current chip manufacturing constraints. Moore’s Law is described as reaching physical limits and producing diminishing economic returns due to geometric scaling. Huawei introduced the Tau (τ) Scaling Law, based on time, and presented it as a path for semiconductor development. Huawei reported mass production of 381 chips using the Tau Scaling Law across multiple industries. Huawei also developed the LogicFolding architecture to continuously compress signal propagation delay and improve transistor density, applicable from semiconductors to circuits and systems. Huawei plans to use LogicFolding first in 2026 Kirin smartphone chips and later target transistor density equivalent to 1.4nm by 2031, while emphasizing openness and partner collaboration.

"Moore's Law has been around for more than five decades now and has shaped the chip manufacturing industry. Still, lately, it has been facing physical limits and diminishing economic returns, partially because it's based on geometric scaling. Huawei came up with a new scaling law called "Tau (τ) Scaling Law." It's based on time, and Huawei believes it's the way to go when it comes to semiconductor industry development."

"Huawei has already mass-produced 381 chips used in a wide range of industries based on the Tau Scaling Law. Thanks to the new scaling law, Huawei also developed a new LogicFolding architecture that continuously compresses signal propagation delay and improves transistor density in semiconductors. The architecture is applicable not just to semiconductors but circuits, systems and other types of chips."

"Huawei's next-generation 2026 Kirin chips for smartphones will be the first to adopt the LogicFolding architecture, which is expected to boost performance significantly over the previous generations. The first chips will hit the market this fall. Huawei also promises high-end Huawei chips in 2031 to feature transistor density equivalent to 1.4nm chips."

"The Chinese tech giant also reached out to partners worldwide, stating that openness and collaboration are the way to go forward, and no single company will be able to solve all the technical limitations that arise with semiconductor evolution."

Read at GSMArena.com