layered floral stickers transform paper into 3D modular bouquet letter set

"Halu Maison Letter Bouquet is a modular letter set that enables users to construct a bouquet by layering thick, embossed stickers shaped as flowers and leaves onto a paper base. The components are produced using Towa Mark's proprietary multi-layer construction method, originally developed for high-durability industrial labels. Layers of paper and film are combined to create material thickness, then pressed with custom molds to generate sculptural relief."

"Rather than delivering a pre-composed greeting card, Letter Bouquet by OKUNOTE Tokyo Studio functions as an assembly-based system. The act of arranging and layering the embossed elements becomes part of the communication process, extending the role of stationery into a tactile and participatory format."

"The embossing process produces a tactile surface that responds to light, introducing dimensional variation across the paper substrate. The floral motifs do not replicate botanical realism; instead, they draw from Nordic textile abstraction, resulting in simplified, graphic forms. The adhesive backing is partially applied, allowing elements to be layered and repositioned to create adjustable depth and spatial composition."

Letter Bouquet is a modular letter set developed by Tokyo-based label manufacturer Towa Mark in collaboration with OKUNOTE Tokyo Studio. The product reimagines stickers as three-dimensional compositional elements using proprietary multi-layer construction combining paper and film, pressed with custom molds to create sculptural relief. Floral motifs draw from Nordic textile abstraction rather than botanical realism. The partially applied adhesive backing allows repositioning and layering to create adjustable depth. The base uses Japanese washi paper compatible with customization like watercolor or fragrance. Users assemble the embossed elements themselves, making the arrangement process part of the communication experience. The project launches on a Japanese crowdfunding platform in February 2026.

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