"On Thursday, Huawei rotating chair Eric Xu revealed the next iterations of the company's Ascend AI chips. Huawei will release the Ascend 950PR in the first quarter of 2026, followed by the Ascend 950DT at the end of that same year. The Ascend 960 and the Ascend 970 would follow in Q4 2027 and Q4 2028 respectively. Xu noted that all the chips will come with Huawei-designed high-bandwidth memory."
"Huawei also unveiled its new SuperPoD cluster designs, which link together thousands of Ascend chips. Xu called the cluster "a single logical machine, made up of multiple physical machines that can learn, think, and reason as one," according to an official company transcript of his remarks. "We're pretty confident that, for the next few years, the Atlas 950 SuperPoD will remain the world's most powerful SuperPoD. And it will far exceed its counterparts across all major metrics," Xu said."
Huawei presented a multi-year roadmap for its Ascend AI chips, scheduling the Ascend 950PR in Q1 2026, the Ascend 950DT at the end of 2026, the Ascend 960 in Q4 2027, and the Ascend 970 in Q4 2028. All chips will include Huawei-designed high-bandwidth memory. Huawei introduced SuperPoD cluster designs that link thousands of Ascend chips into a single logical machine capable of collective learning and reasoning. Huawei projects the Atlas 950 SuperPoD will lead global performance metrics for years. Clustering is intended to offset manufacturing limits from U.S. sanctions by aggregating many chips for higher performance.
Read at Fortune Asia
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