"Helios combines AMD EPYC central processing units (CPUs), AMD Instinct graphics processing units (GPUs), AMD Pensando advanced networking and the AMD ROCm open software stack to deliver what is being described as a cohesive platform optimised for performance, efficiency and scalability. AMD says the system is engineered to simplify deployment of large-scale AI clusters, enabling faster time to solution and greater infrastructure flexibility across research, cloud and enterprise environments."
"Built on the OCP Open Rack Wide design, Helios is designed to help customers and partners streamline deployment timelines and deliver a scalable, flexible offering for demanding AI workloads. The Helios rack-scale AI platform delivers up to 2.9 exaFLOPS of FP4 performance per rack using AMD Instinct MI455X GPUs, AMD EPYC Venice CPUs and AMD Pensando Vulcano network interface cards for scale-out networking."
AMD and HPE expanded their collaboration to accelerate development of next-generation open, scalable AI infrastructure centered on the Helios rack-scale AI architecture. HPE will adopt Helios and integrate an HPE Juniper Networking scale-up switch developed with Broadcom for seamless, high-bandwidth Ethernet connectivity. Helios combines AMD EPYC CPUs, AMD Instinct GPUs, AMD Pensando networking and the AMD ROCm open software stack into a cohesive platform optimized for performance, efficiency and scalability. The platform is built on OCP Open Rack Wide and can deliver up to 2.9 exaFLOPS FP4 per rack using Instinct MI455X GPUs, EPYC Venice CPUs and Pensando Vulcano NICs. Helios is engineered to simplify deployment of large-scale AI clusters and improve time to solution and infrastructure flexibility across research, cloud and enterprise environments.
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