Jericho4, Broadcom's latest network chip, addresses the demand for scalable AI infrastructure by allowing the interconnection of over a million processors across multiple data centers. This enables cloud providers to position smaller data centers closer to customers while operating as a single large unit for AI model training and execution. The chip processes four times more data than its predecessor and manages traffic volume effectively, maintaining stability during high usage. It also incorporates robust security features, including data encryption, and is manufactured using TSMC's three-nanometer process for improved performance and energy efficiency.
Jericho4 raises the bar by enabling the interconnection of multiple data centers into a single integrated AI system, catering to the growing demand for scalable AI infrastructure.
The chip processes approximately four times as much data as its predecessor and includes improvements aimed at managing high volumes of network traffic, enhancing stability during intensive AI tasks.
A single system can contain approximately 4,500 Jericho4 chips, providing hyperscalers the building blocks to scale up AI capacity quickly and efficiently.
Extensive security measures, including data encryption, are included in the chip to protect sensitive information transmitted between data centers.
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