"This year we can see it introduce 2nm chips, with 1.4nm to follow probably in 2028 and the huge leap to sub-1nm processors to follow in 2030-31."
"Those performance gains, combined with improved energy consumption, allows Apple's hardware designers to work towards thinner, lighter and smaller devices in a range of design configurations."
"Apple has a wide open road for chip design, and while tensions between today's US and China could derail some of these plans, TSMC's continued investment in fabrication capacity in the US might help mitigate against even that potential calamity."
Apple plans to skip TSMC's 1.6nm process, moving directly to 2nm chips this year, followed by 1.4nm in 2028 and sub-1nm by 2030-31. These advancements will significantly enhance performance across Apple's hardware, including future MacBook and iPhone models. Improved energy consumption will enable the creation of thinner and lighter devices, potentially leading to innovative designs. Despite geopolitical tensions, TSMC's investment in US fabrication capacity may help sustain Apple's chip development plans.
Read at Computerworld
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