"MediaTek is expected to unveil the Dimensity 9600 SoC later this year as its next flagship chip, but the company is also working on the Dimensity 8600 upper-midrange SoC as well. This is important because in recent times, MediaTek's Dimensity 8 series chips have dominated AnTuTu benchmark ratings for upper-midrange phones - it kind of seems like Qualcomm has decided to just hand over this market to MediaTek."
"According to a new rumor from China today, this chip will be using a 3nm process, which will be a notable improvement since the 8500 is built on a 4nm process. Furthermore, the 8600 will come with "a completely upgraded architecture", the source of this rumor claims without going into any more details unfortunately."
"The Dimensity 8-series was always notable for using an all-"big"-core design, so we're probably getting upgraded cores. We are however wondering if hoping for one Prime core would be too much given the cost effectiveness of this platform. Time will tell."
"Either way, devices from Oppo, vivo, and their sub-brands are currently being tested with the upcoming Dimensity 8600 chipset, and they're expected to launch by the end of the year - some of them with 10,000 mAh batteries even."
MediaTek is expected to release the Dimensity 9600 flagship later this year and is also developing the Dimensity 8600 upper-midrange SoC. MediaTek’s Dimensity 8 series has recently led AnTuTu benchmark ratings in the upper-midrange segment, suggesting Qualcomm has ceded ground. A rumor from China claims the Dimensity 8600 will be manufactured on a 3nm process, improving over the Dimensity 8500’s 4nm process. The chip is also said to feature a completely upgraded architecture, likely involving upgraded CPU cores. Oppo, vivo, and related brands are reportedly testing devices using the Dimensity 8600, with launches expected by year-end, including models with 10,000 mAh batteries.
Read at GSMArena.com
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