
"TSMC's 2nm (N2) process entered mass production in early 2026, the most advanced node available anywhere. Gate-All-Around nanosheet transistors deliver up to 30% better power efficiency versus 3nm, and Apple booked over 50% of TSMC's initial 2nm capacity for 2026 to feed next-generation A20 and M5 silicon. Qualcomm, Samsung's silicon clients, and Google's TPU partners are fighting over the leftovers or holding on 3nm."
"TSMC chairman C.C. Wei was blunt on the Q1 call: "Capacity is very tight... it takes 2 to 3 years to build a new fab." Translation: nobody is catching Apple's allocation in 2026. 3nm already accounts for 25% of TSMC's wafer revenue, with 7nm-and-below at 74%."
"Apple's $147 billion in cash and marketable securities is a weapon. HBM3e and HBM4 production at SK Hynix and Micron is sold out through end of 2026, with memory prices up 80% to 90% versus late 2025. Tim Cook called this out directly: "beyond the June quarter, we believe memory costs will drive an increasing impact on our business.""
"The board authorized a $100 billion buyback. That is confidence in a vertically integrated silicon model rather than a hope-and-spend strategy. Alphabet, sitting on a 26.06% YTD gain, is spending toward a record $180 billion in 2026 capex on Gemini and Android XR. Meta raised it"
TSMC’s 2nm process entered mass production in early 2026, offering gate-all-around nanosheet transistors with up to 30% better power efficiency than 3nm. Apple booked over half of TSMC’s initial 2nm capacity for 2026 to supply next-generation A20 and M5 silicon, while other major chip buyers compete for remaining capacity or rely on 3nm. TSMC capacity is described as very tight, with new fabs taking 2 to 3 years to build. Apple’s cash and marketable securities support memory procurement, with HBM3e and HBM4 production sold out through end of 2026 and memory prices up sharply. Apple expects memory costs to increasingly affect business results, and rivals report handset weakness tied to memory constraints.
Read at 24/7 Wall St.
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